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FCCL (Flexible Copper Clad Laminate) is mainly used in flexible printed circuit boards, and is used in computers, telecommunication systems, automobiles, consumer electronics, industrial control devices, medical devices, instrumentation, military and aerospace. And other fields. Polyimide film products for FCCL have better performance than general polyimide film products
Due to the trend toward miniaturization, light weight, and high density of electronic products, the PIF requirements for FCCL are getting higher and higher. Mainly reflected in ultra-thin, co-extruded multi-layer type. The outstanding requirements are low heat shrinkage, greater tensile strength and higher modulus of elasticity.